
STP-200/300/400 Series Instruction Manual
7 Baking, Cooling and Gas Suction of the STP Pump
7.1 Baking the STP Pump
To attain a lower pressure in a shorter time and reduce the exhaust time, bake
the vacuum equipment and STP pump.
◇ The surfaces of the STP pump and its peripheral equipment will
become extremely hot when performing baking. NEVER touch them
with bare hands.
◇ When baking the STP pump, always cool it to prevent overheating
(For the cooling method, see Section 7.2, "Cooling the STP Pump").
◇ Start baking after cooling is started.
Set the temperature of the baking heater to 120°C or less
(An optional baking heater is set to 110°C or less).
◇ DO NOT pump gases during baking to prevent overheating.
◇ To exhaust the gas discharged from the vacuum equipment and the
inner wall of the STP pump, run the STP pump during baking.
7-1
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