Sharp DP-750 Manual de Serviço Página 228
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228 • Use in Hazardous Environments
Classification Meeting CENELEC and IEC
WAGO-I/O-SYSTEM 750
Bus System
6.3.2 Explosion Protection Group
In addition, the electrical components for explosive areas are subdivided into
two groups:
Group I: Group I includes electrical components for use in fire-damp
endangered mine structures.
Group II: Group II includes electrical components for use in all other
explosive environments. This group is further subdivided by
pertinent combustible gases in the environment.
Subdivision IIA, IIB and IIC takes into account that
different materials/substances/gases have various ignition
energy characteristic values. For this reason the three sub-
groups are assigned representative types of gases:
IIA – Propane
IIB – Ethylene
IIC – Hydrogen
Tab. 6-1: Minimal ignition energy of representative types of gases
Minimal Ignition Energy of Representative Types of Gases
Explosion group I IIA IIB IIC
Gases Methane Propane Ethylene Hydrogen
Ignition energy (µJ) 280 250 82 16
Hydrogen being commonly encountered in chemical plants, frequently the
explosion group IIC is requested for maximum safety.
- Technical description 1
- Version 1.0.1 1
- Table of Contents 3
- 1 Important Notes 9
- 10 • Important Notes 10
- Legal Principles 10
- WAGO-I/O-SYSTEM 750 10
- Bus System 10
- Important Notes • 11 11
- 1.3 Symbols 12
- 1.4 Safety Information 13
- 1.5 Font Conventions 14
- 1.6 Number Notation 14
- 1.7 Scope 15
- 1.8 Abbreviation 15
- 2 The WAGO-I/O-SYSTEM 750 16
- 2.2 Technical Data 17
- Side view 22
- Dimensions in mm 22
- 2.3 Manufacturing Number 23
- 2.4 Component Update 24
- 2.6 Mechanical Setup 25
- Mechanical Setup 26
- 2.6.4 Spacing 27
- 2.6.6 Assembly Sequence 29
- 2.6.8 Power Contacts 31
- 2.6.9 Wire Connection 32
- 2.7 Power Supply 33
- 2.7.2 System Supply 34
- 2.7.3 Field Supply 37
- 2.7.5 Supply Example 42
- 2.7.6 Power Supply Unit 43
- 2.8 Grounding 44
- 2.8.2 Grounding Function 45
- 2.8.3 Grounding Protection 46
- 2.9 Shielding (Screening) 47
- 3.1 Description 49
- Description 50
- 3.2 Hardware 51
- 3.2.2 Device Supply 52
- 3.2.3 Field Bus Connection 53
- 3.2.4 Display Elements 54
- Hardware 55
- Hardware 56
- 3.2.7 Operating Mode Switch 57
- 3.3 Operating System 58
- 3.3.2 PFC Cycle 59
- Operating System 60
- 3.4 Process Image 61
- Process Image 62
- Programmable 63
- Fieldbus 63
- 3.4.4 Data Exchange 64
- 3.4.5 Memory Areas 64
- I/O modules 65
- 3.4.6 Addressing 67
- 3.6 Configuration 76
- Configuration 77
- 3.6.3 GSD Files 78
- 3.6.4 Identification Bytes 79
- 3.6.5 Example 83
- 3.9 Diagnostics 90
- 3.9.5 Device Status 92
- WAGO-I/O-SYSTEM 750 101
- 3.10.1 Data Areas 103
- 3.11 LED Signaling 109
- 3.11.2 Field Bus Status 110
- 3.11.4 Node Status 112
- LED Signaling 113
- the related function 117
- 3.12 Fault Behavior 119
- 3.13 Technical Data 120
- 4 Field Bus Communication 122
- 4.1.2 Wiring 123
- PROFIBUS 124
- PROFIBUS 125
- 5 I/O Modules 126
- 5.1.3 Analog Input Modules 129
- 5.1.4 Analog Output Modules 131
- 5.1.5 Special Modules 132
- 5.1.6 System Modules 134
- 5.2.1 2 DI I/O Modules 135
- 5.2.3 4 DI I/O Modules 136
- 5.2.4 8 DI I/O Modules 136
- 5.2.5 16 DI I/O Modules 136
- 5.2.6 2 DO I/O Modules 136
- 5.2.8 4 DO I/O Modules 137
- 5.2.10 8 DO I/O Modules 138
- 5.2.12 16 DO I/O Modules 138
- 5.2.13 Power Supply Modules 138
- 5.2.14 2 AI I/O Modules 139
- 5.2.15 4 AI I/O Modules 140
- 5.2.16 2 AO I/O Modules 141
- 5.2.17 4 AO I/O Modules 142
- 5.2.18 Counter Modules 143
- 5.2.19 PWM Module 144
- 5.2.20 Stepper Controller 144
- 750-630 145
- 750-631, 750-634, 750-637 146
- 750-635 146
- 5.2.24 Serial Interface 147
- 5.2.25 Data Exchange Module 148
- 5.2.26 DALI/DSI Master 149
- 5.2.27 AS Interface Master 149
- 750-660, 750-665, 750-666 150
- 5.3.1 Binary Input Modules 151
- 5.3.2 Binary Output Modules 152
- 5.3.3 Supply Modules 152
- 5.3.4 Analog Input Modules 153
- 5.3.5 Analog Output Modules 153
- 5.3.6 Special Modules 154
- 5.3.7 Field Bus Variables 155
- 156 • I/O Modules 156
- I/O Modules • 157 157
- 158 • I/O Modules 158
- I/O Modules • 159 159
- 160 • I/O Modules 160
- 5.4.1 Digital I/O Modules 161
- 162 • I/O Modules 162
- I/O Modules • 163 163
- 164 • I/O Modules 164
- I/O Modules • 165 165
- 166 • I/O Modules 166
- I/O Modules • 167 167
- 168 • I/O Modules 168
- I/O Modules • 169 169
- 170 • I/O Modules 170
- I/O Modules • 171 171
- 172 • I/O Modules 172
- I/O Modules • 173 173
- 174 • I/O Modules 174
- I/O Modules • 175 175
- 176 • I/O Modules 176
- I/O Modules • 177 177
- 178 • I/O Modules 178
- I/O Modules • 179 179
- 180 • I/O Modules 180
- I/O Modules • 181 181
- 182 • I/O Modules 182
- I/O Modules • 183 183
- 184 • I/O Modules 184
- 5.4.2 Analog I/O Modules 185
- 186 • I/O Modules 186
- I/O Modules • 187 187
- Information 188
- I/O Modules • 189 189
- I/O Modules • 191 191
- 192 • I/O Modules 192
- 7 6 5 4 3 2 1 0 194
- 15 14 13 12 11 9 8 7 194
- 15 14 13 12 11 10 9 8 196
- 5.4.5 Serial Interfaces 198
- 5.4.6 Data Exchange Module 199
- 5.4.8 DALI/DSI Master 201
- 5.4.9 AS Interface Master 202
- I/O Modules • 203 203
- 5.4.10 PROFIsafe Modules 204
- I/O Modules • 205 205
- 5.5.1 2 DI I/O Modules 206
- 5.5.3 4 DI I/O Modules 206
- 5.5.4 8 DI I/O Modules 207
- 5.5.5 16 DI I/O Modules 207
- 5.5.6 2 DO I/O Modules 208
- 5.5.8 4 DO I/O Modules 208
- 5.5.10 8 DO I/O Modules 210
- 5.5.12 16 DO I/O Modules 212
- 5.5.15 2 AI I/O Modules 214
- 5.5.16 4 AI I/O Modules 215
- 5.5.17 2 AO I/O Modules 217
- 5.5.18 4 AO I/O Modules 218
- 5.5.21 SSI Interface 222
- 5.5.25 DALI/DSI Master 224
- 5.5.26 AS Interface Master 224
- 6.1 Foreword 226
- 6.2 Protective Measures 226
- 6.3.3 Unit Categories 229
- 6.3.4 Temperature Classes 230
- 6.4.1 Divisions 232
- 6.4.3 Temperature Classes 233
- 6.5 Identification 234
- Explosion protection group 235
- (condition of use category) 235
- 6.6 Installation Regulations 236
- Installation Regulations 237
- 7 List of Literature 238
- 8 Index 239
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