Sharp IV-C35M Manual do Utilizador descarregar pdf (Página 9)

C35 Application Note

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RoHS Compliant www.semileds.com

C35 Application Note V1.3

Subject to change without notice

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RecommendedManualReworkProcedure

Step1:Setupthehotplatetemperatureproperly.DonotputthePCBonthehotplatebeforethe

temperatureisstableatthesetvalue.

Step2:UsetweezerstotaketheC35fromthePCBcarefullyoncethesolderpaste hasmelted.

Step3:Checkthesolderpads

condition.Makesurethesolderpadsarecoveredbythesolderpaste.

Step4:PuttheLEDbacktothePCBproperly.Thetimefromstep2tostep4shouldbecompleted

within30seconds.

Step5:TakethePCBoutofthehotplateandputiton 

aheatsinktocooldownthePCBtemperature.

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Notes:

1. Avoidsolderballswhichmayshortanode,cathodeorthermalpad,suchasinFigure10.

2. AvoidexternalmechanicalforceappliedontheLEDlensorsubstrate.

3. Donottouchthelenssurfacewithsharpobjectsorfingers.

4. Leakagepathmayexistwhensub‐mountcracks

orchipsduetodamagefromun‐suitablehandling.

5. FinalinspectionandtestissuggestedafterSMTprocessforeachemitter.

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Figure10.SolderingProblem

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Sharp IV-C35M Manual do Utilizador Página 9